JPS6326545B2 - - Google Patents

Info

Publication number
JPS6326545B2
JPS6326545B2 JP10894779A JP10894779A JPS6326545B2 JP S6326545 B2 JPS6326545 B2 JP S6326545B2 JP 10894779 A JP10894779 A JP 10894779A JP 10894779 A JP10894779 A JP 10894779A JP S6326545 B2 JPS6326545 B2 JP S6326545B2
Authority
JP
Japan
Prior art keywords
solder
container
lid member
cover member
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10894779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5632749A (en
Inventor
Takehisa Tsujimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10894779A priority Critical patent/JPS5632749A/ja
Publication of JPS5632749A publication Critical patent/JPS5632749A/ja
Publication of JPS6326545B2 publication Critical patent/JPS6326545B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP10894779A 1979-08-27 1979-08-27 Manufacture of semiconductor device Granted JPS5632749A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10894779A JPS5632749A (en) 1979-08-27 1979-08-27 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10894779A JPS5632749A (en) 1979-08-27 1979-08-27 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5632749A JPS5632749A (en) 1981-04-02
JPS6326545B2 true JPS6326545B2 (en]) 1988-05-30

Family

ID=14497671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10894779A Granted JPS5632749A (en) 1979-08-27 1979-08-27 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5632749A (en])

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5215458A (en) * 1988-03-04 1993-06-01 Bic Corporation Child-resistant lighter with spring-biased, rotatable safety release
WO1990000239A1 (fr) * 1988-07-01 1990-01-11 Sibjet S.A. Briquet de securite
US5445518A (en) * 1988-09-02 1995-08-29 Bic Corporation Selectively actuatable lighter
US5002482B1 (en) * 1988-09-02 2000-02-29 Bic Corp Selectively actuatable lighter
US5456598A (en) * 1988-09-02 1995-10-10 Bic Corporation Selectively actuatable lighter
FR2705762B1 (fr) * 1993-05-28 1995-08-18 Hameur Cie Sécurité de briquet.
US5558514A (en) * 1994-05-27 1996-09-24 Hameur Et Cie Safety latch for a lighter

Also Published As

Publication number Publication date
JPS5632749A (en) 1981-04-02

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